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3M Scotch-Weld Epoxy Potting Compound 270, Clear, Part B, 5 Gallon (Pail), 1 Can per drumum

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MSRP: $3,247.38
Online: $2,062.09
(You save $1,185.29 )
SKU:
7000028567
UPC:
00021200822506
Shipping:
Calculated at Checkout
Free Shipping Available::
Free ground shipping is offered on combined order amount of $500 or more to locations within continental United States
Quick Contact::
(Text) (877) 627-3669 or (Email) support@apdindustrial.com
Effective Date::
April 1 2026
Lead Time::
Due to continuing raw material instability, lead time are 3M's current best estimates. Actual lead time may vary.
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Product Overview

3M Stock#: 7000028567; 3M Legacy Stock#: 62326285301; 3M Catalog#: 270; Sales UPC: 00021200822506; Stock Type: Make To Order; Mfg Suggested Lead Time (In Days): 43; 1 Unit in Cart Represents: 5 US gallon; 3M Minimum Order Qty: 5 US gallon; 3M Incremental Order Qty: 5 US gallon (if you intend to place more than a qty of 1 in the cart and 3M minimum order qty and incremental order qty is not the same, please contact us prior to ordering); Consumer UPC: NA; Inner UPC: NA; Shipper UPC: 50021200822501; Weight Unit and Weight: US gallon NA; Shelf Life: 547 Days; Country of Origin: USA; ECCN Number: EAR99; Harmonizing Code: 3907300000; Transport Protective Service: PROTECTIVE SERVICE NOT REQUIRED; Ground Transportation (US DOT, 49 CFR): NOT RESTRICTED, AS PER 49 CFR 171.4, MARINE POLLUTANT EXCEPTION; Vessel Transportation (US DOT, 49 CFR): UN3082, ENVIRONMENTALLY HAZARDOUS SUBSTANCE, LIQUID, N.O.S., (EPOXY RESIN), 9, III, MARINE POLLUTANT, (EPOXY RESIN); International Air Transport Association: UN3082, ENVIRONMENTALLY HAZARDOUS SUBSTANCE, LIQUID, N.O.S., (EPOXY RESIN), 9, III; International Maritime Organization: UN3082, ENVIRONMENTALLY HAZARDOUS SUBSTANCE, LIQUID, N.O.S., (EPOXY RESIN), 9, III, MARINE POLLUTANT, (EPOXY RESIN); Product Description: 3M™ Scotch-Weld™ Epoxy Potting Compound DP270 is low viscosity for easy dispensing and potting. It is non-corrosive to copper, minimal exotherm and very low shrinkage – making it well-suited for potting and bonding electronic and electrical components.

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