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7010398771 3M EMI Copper Foil Shielding Tape 1182, 3/4 in x 18 yd (19.05 mm x 16.5m), Double Coate, 12 per case

3M

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MSRP: $1,227.38
Online: $779.39
(You save $447.99 )
SKU:
7010398771
Availability:
3M Stock Type: Make To Order. Estimated time (In business days) to Ship: 14
Shipping:
Calculated at Checkout
Catalog Nbr:
1182-3/4X18YD"
Stock Nbr:
7010398771
Each Cart Qty Contains:
12 Roll
Shipper Conversion:
1 Case = 12 Roll
Effective Date:
2024April
Product Name:
3M™ EMI Copper Foil Shielding Tape 1182, 3/4 in x 18 yd (19.05 mm x 16.5 m), Double Coate, 12 per case
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Product Overview

3M Sales UPC: 00051138496722; 3M 5-Digit Part Number: 49672; 3M Previous Stock Number: 80610882518; 3M Consumer UPC: No Data; 3M Inner UPC: No Data; 3M Shipper UPC: 50051138496727; Ship Container Length: 22.067 (Centimeter); Ship Container Height: 26.035 (Centimeter); Ship Container Width: 20.955 (Centimeter); Ship Container Volume: 12038.948 (Cubic centimeter); Ship Container Weight: 2.616 (Kilogram); Shelf Life: 1825 Days; Country of Origin: Taiwan; ECCN Number: EAR99; Harmonizing Code: 7410110000; Transport Protective Service: PROTECTIVE SERVICE NOT REQUIRED; NMFC Item: 030740; NMFC Sub: 02; NMFC Class: 060.0; US DOT, 49 CFR Ground: NOT REGULATED; US DOT, 49 CFR Vessel: NOT REGULATED; International Air Transport Association (IATA): NOT REGULATED; International Maritime Organization (IMO): NOT REGULATED. Product Information: 3M™ Copper Foil EMI Shielding Tape 1182 is a 3.5 mil thick acrylic adhesive shielding tape. This flame retardant tape is designed to bond 2 surfaces together physically and electrically. It comes on a removable liner for easy die cutting and handling. The tape is rated for 600V dry applications.. 3M™ EMI Shielding Tape 1182 has deadsoft, copper foil backing with a pressure sensitive, electrically conductive, acrylic adhesive coating on both sides that ensures firm adherence. The conductive particles in the adhesive offer low resistance between the substrate and the backing. The construction of the tape offers a good method of bonding and grounding conductive surfaces. UL Listed and RoHS 2011/65/EU Compliant.

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