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7010296643 3M Electrically Conductive Thermosetting Film 2201P, 360 mm x 100 m, 2Rolls/Case

3M

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MSRP: $14,697.29
Online: $9,332.78
(You save $5,364.51 )
SKU:
7010296643
Availability:
3M Stock Type: Make To Order. Estimated time (In business days) to Ship: 42
Shipping:
Calculated at Checkout
Catalog Nbr:
2201P
Stock Nbr:
7010296643
Each Cart Qty Contains:
2 Roll
Shipper Conversion:
1 Case = 2 Roll
Effective Date:
2024April
Product Name:
3M™ Electrically Conductive Thermosetting Film 2201P, 360 mm x 100 m, 2 Rolls/Case
Adding to cart… The item has been added

Product Overview

3M Sales UPC: 00048011652054; 3M 5-Digit Part Number: 65205; 3M Previous Stock Number: 70071545845; 3M Consumer UPC: No Data; 3M Inner UPC: No Data; 3M Shipper UPC: 50048011652059; Ship Container Length: 59.300 (Centimeter); Ship Container Height: 48.500 (Centimeter); Ship Container Width: 58.400 (Centimeter); Ship Container Volume: 167961.320 (Cubic centimeter); Ship Container Weight: 21.747 (Kilogram); Shelf Life: 548 Days; Country of Origin: USA; ECCN Number: EAR99; Harmonizing Code: 5911102000; Transport Protective Service: MAINTAIN TEMP BETWEEN 35-45F (2-7C); NMFC Item: 156830; NMFC Sub: 00; NMFC Class: 000.0; US DOT, 49 CFR Ground: NOT REGULATED; US DOT, 49 CFR Vessel: NOT REGULATED; International Air Transport Association (IATA): NOT REGULATED; International Maritime Organization (IMO): NOT REGULATED. Product Information: 3M™ Electrically Conductive Thermosetting Film (C-TSF) 2201P is an XYZ-axis electrically conductive thermosetting film. This double-sided film has a nickel/copper-coated conductive nonwoven carrier. Designed for EMI shielding and grounding applications, enabling devices to meet electromagnetic compatibility requirements..

3M™ Electrically Conductive Thermosetting Film 2201P typically has the highest electrical conductivity, adhesion, and overall performance of conductive pressure sensitive adhesive (CPSA) products due to the thermoset resin. The excellent conductivity makes it ideal for small contact areas. This tape requires a modest thermal bonding process under pressure and special storage conditions. This tape provides robust protection against EMI in a range of market segments such as consumer electronics, automotive, medical devices, communication infrastructure, and aerospace & defense electronics.


Recommended Applications:
PCB/flex/chassis grounding
Bond line gap shielding
Electrostatic discharge (ESD)
EMI shield & gasket attachment
Passive intermodulation (PIM) management


From simple to complex designs, our family of shielding and grounding solutions provides protection against EMI. Our solutions provide excellent adhesion to a variety of substrates including metals and plastics. These tapes are easy to apply using low pressure without heat, enhancing productivity. We have multiple thicknesses available to meet even the most space constrained and complex design requirements.

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